Failure analysis (FA) is a post inspection of failed components. According to the needs, electrical testing and various advanced physical, metallographic, and chemical analysis techniques are used, combined with specific situations before and after component failure and relevant technical documents for analysis, to verify the reported failure, determine the failure mode, failure mechanism, and causes of component failure.
products catalog
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![TEM Imaging And Analysis]()
TEM Imaging And AnalysisTransmission electron microscopy (TEM) has become an indispensable analytical instrument in the fields of materials and semiconductors. It is an electron optical instrument that uses a high-energyread more -
![Advanced FIB & TEM For Wafers Analysis]()
Advanced FIB & TEM For Wafers AnalysisAdvanced process wafer-level FIB sample preparation and TEM analysis services provide precise sample preparation and structural analysis solutions for advanced process chips by performing FIB sampleread more -
![DB-FIB (Dual-Beam Focused Ion Beam)]()
DB-FIB (Dual-Beam Focused Ion Beam)GRGTEST Metrology provides professional dual-beam focused ion beam (DB-FIB) analysis services. Popular testing services include TEM sample sections for advanced processes (14 nm and below), FAread more -
![Wafer Cleaving Equipment And SEM Imaging]()
Wafer Cleaving Equipment And SEM ImagingWafer cleaving equipment and SEM imaging services are key technological supports for materials science, electronics industry and biomedical research, and are especially suitable for internalread more -
![AFM (Atomic Force Microscopy) Analysis]()
AFM (Atomic Force Microscopy) AnalysisThe Bruker Dimension ICON6 atomic force microscope supports 12 modes, including contact, tapping, and peak force tapping, to meet the testing needs of different samples and provide diverse testingread more -
![Energy Dispersive Spectroscopy (EDS) Analysis]()
Energy Dispersive Spectroscopy (EDS) AnalysisEDS stands for Energy Dispersive Spectrometer, which is an X-ray energy dispersive spectroscopy analysis method. Its principle is based on the fact that different elements emit characteristic X-raysread more -
![PFIB (Plasma Focused Ion Beam)]()
PFIB (Plasma Focused Ion Beam)Compared to traditional gallium-ion focused ion beam (Ga-FIB), PFIB utilizes a more powerful xenon (Xe) ion beam, achieving a maximum current of 2.5 μA at 30 keV energy, which increases its etchingread more -
![FT (Final Test) Mass Production Testing]()
FT (Final Test) Mass Production TestingGRGTEST has one-stop FT software and hardware solutions, and can provide customers with a full range of services including test technology evaluation, test solution development, test hardwareread more -
![Aerospace Wire And Cable Testing]()
Aerospace Wire And Cable TestingGRGTEST has established comprehensive capabilities for material analysis, physical characteristic analysis, functional performance testing, reliability verification, failure analysis, and lifetimeread more -
![Fiber Optic Cables And Connector]()
Fiber Optic Cables And ConnectorIn modern communications and data centers, fiber optic communication has become indispensable due to its advantages of high speed, large capacity, and long-distance transmission. The application ofread more -
![Chip-Level ESD Testing]()
Chip-Level ESD TestingChip-level ESD (Electrostatic Discharge) testing is a reliability test for Integrated Circuits (ICs) used to evaluate a chip's ability to resist electrostatic discharge interference duringread more -
![OBC Durability Test]()
OBC Durability TestThis service, in accordance with the GB/T 40432-2021 standard, conducts 7 categories and 20+ extreme tests on On-Board Chargers (OBCs), including temperature cycling (-40°C to 85°C), damp heat agingread more
Significance of Component Failure Analysis Testing
Root Cause Identification
Utilizing reverse engineering and microstructural analysis to pinpoint failure mechanisms (e.g., electromigration, thermal stress fatigue, interfacial delamination), thereby eliminating systemic risks across design-manufacturing processes.
Reliability Enhancement
Developing failure prediction models based on Failure Mode Database (FMD) to optimize material selection, process parameters, and DFMEA (Design Failure Mode & Effects Analysis), effectively increasing MTBF (Mean Time Between Failures).
Compliance Assurance
Detecting latent failures caused by ESD, Moisture Sensitivity Level (MSL), or soldering defects to prevent product recalls, regulatory penalties, or non-compliance with IEC/ISO certifications.
Lifecycle Cost Reduction
Proactive failure analysis minimizes field failure rates and warranty costs, while establishing technical benchmarks for supply chain quality audits to block substandard components.
Company advantages
GRGTEST, as a state-supported listed integrated circuit public service platform, is the most comprehensive and widely recognized third-party testing institution in the domestic semiconductor integrated circuit field. It is committed to providing professional quality evaluation and reliability enhancement technical services for the entire semiconductor industry chain.
AEC-Q Test Series
Component Failure Analysis
Through analysis and verification, simulate the reproduction of the phenomenon of failure, find out the cause of failure, dig out the mechanism of failure activities, and improve the product quality.
Advanced Testing Capabilities
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X-Ray NDT Testing
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LED Failure Analysis
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Ion Cleanliness Testing
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Digital (3C) Product Testing
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IGBT and Semiconductor Testing
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Screening of Electronic Components
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Failure Analysis of Semiconductor Chips
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Power Module Aging and Test Verification
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PCB Board-Level Process Quality Evaluation
What Are the Common Material Failure Analysis Testing?
Corrosion Mechanism and Fatigue Test
GRGTEST provides cable harnesses modelling for EMC, crosstalk simulation, radiation immunity simulation, radiation emission simulation, and layout simulation analysis.
Metal and Polymer Materials Analysis
With many years of Metal And Polymer Materials Analysis experience, electrochemical corrosion, metal and non-metal component analysis, polymer material routine performance testing, fracture analysis and other fields, the quality problems would be solved in a short time for customers.
Material Consistency Evaluation and Thermodynamic
GRGTEST is committed to quality control by helping enterprises establish a consistency map.
Surface Insulation Resistance (SIR) Test
The surface insulation resistance (SIR) test of GRGT is conducted by continuously applying a certain bias voltage to the PCB in a high temperature and high humidity environment, and observing whether there is a momentary short circuit or slow leakage of insulation failure between the lines after a long period of testing.
Milling Grinding Tests
Internal defect detection methods often involve sample preparation techniques such as Decap, Cross section, Delayer, etc. Milling Grinding Tests is an advanced auxiliary technique commonly used in slicing and sample preparation technology.
About GRGTEST
GRGTEST adheres to market-oriented operation, vigorously carries out technological innovation, and has built a one-stop comprehensive technical service capability for the entire industry chain, including "Measurement+Scientific Research+Evaluation Consultation+Design Analysis+Certification Services "
Qualification Certificate
CNAS
CMA
AS9100D
ABS
CPSC
ISO 27001-2022
Service Process
Online consultation
Fill in the commission
Sample mailing
Report check
Classic case
FAQ
Q: Can the fee be paid after the Environmental reliability testing is completed?
A: Yes. However, the fees must be paid before obtaining the report.
Q: Can the customer watch the test process on site?
A: Yes. You can fill in the relevant application form to make an appointment.
Q: Is there any charge for repeated tests?
A: Retest needs to be recharged.
Q: If the test results are not qualified, can you help to debug the equipment and make the test results become qualified?
A: Yes. However, it belongs to the new business type, the specific needs to confirm with the customer service and engineers.
We are professional failure analysis service provider in China, providing the best labs and solutions. Please feel free to contact us for quotation.
screening of electronic components, failure analysis, aec q102 product test of optoelectronic devices