• PCB Board-Level Process Quality Evaluation
    The GRGT professional team has over 10 years of experience in failure analysis and can provide quality evaluation of automotive electronic lead-free processes for vehicle manufacturers and PCB
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  • LED Failure Analysis
    With the rapid development of LED applications, their failure problems have become particularly prominent, especially the random or permanent non lighting of LEDs, as well as burning, which are key
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  • Corrosion Mechanism and Fatigue Test
    GRGT provides cable harnesses modelling for EMC, crosstalk simulation, radiation immunity simulation, radiation emission simulation, and layout simulation analysis.
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  • Metal and Polymer Materials Analysis
    With the rapid development of industrial production, customers have different understandings of high-demand products and processes, resulting in frequent product failures such as cracking, breaking,
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  • Material Consistency Evaluation and Thermodynamic
    Because plastic is a formulation system composed of basic resins and a variety of additives, raw materials and processes are difficult to control, resulting in the actual production and product use
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  • Microstructure Analysis and Evaluation of Semiconductor M...
    With the continuous development of large-scale integrated circuits, the chip manufacturing process is becoming more and more complex, and the abnormal microstructure and composition of semiconductor
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  • Failure Analysis of Semiconductor Chips
    GRGT has a leading team of experts and advanced failure analysis equipment, which can provide non-destructive analysis, electrical characteristic/electrical positioning analysis, destructive
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  • X-Ray NDT Testing
    X-Ray NDT Testing is a mature non-destructive testing method widely used in material inspection (IQC), failure analysis (FA), quality control (QC), quality assurance and reliability (QA/REL),
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  • Surface Insulation Resistance (SIR) Test
    The Surface Insulation Resistance (SIR) test can be used to evaluate problems caused by short circuits or current leaks between metal conductors, helping to identify whether any flux or other
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  • Milling Grinding Tests
    The commonly used inspection and analysis methods for electronic component failure analysis can be classified into non-destructive analysis and destructive analysis. Destructive analysis is the
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  • Digital (3C) Product Testing
    GRGTEST can provide quality control for product development, design, production, and sales processes, helping companies identify product quality issues and tailor effective solutions.
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We are professional failure analysis service provider in China, providing the best labs and solutions. Please feel free to contact us for quotation.

failure analysis, aec q200 product test of resistance capacitance inductances and other components, ion cleanliness testing
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