-
PCB Board-Level Process Quality EvaluationThe GRGT professional team has over 10 years of experience in failure analysis and can provide quality evaluation of automotive electronic lead-free processes for vehicle manufacturers and PCBread more
-
LED Failure AnalysisWith the rapid development of LED applications, their failure problems have become particularly prominent, especially the random or permanent non lighting of LEDs, as well as burning, which are keyread more
-
Corrosion Mechanism and Fatigue TestGRGT provides cable harnesses modelling for EMC, crosstalk simulation, radiation immunity simulation, radiation emission simulation, and layout simulation analysis.read more
-
Metal and Polymer Materials AnalysisWith the rapid development of industrial production, customers have different understandings of high-demand products and processes, resulting in frequent product failures such as cracking, breaking,read more
-
Material Consistency Evaluation and ThermodynamicBecause plastic is a formulation system composed of basic resins and a variety of additives, raw materials and processes are difficult to control, resulting in the actual production and product useread more
-
Microstructure Analysis and Evaluation of Semiconductor M...With the continuous development of large-scale integrated circuits, the chip manufacturing process is becoming more and more complex, and the abnormal microstructure and composition of semiconductorread more
-
Failure Analysis of Semiconductor ChipsGRGT has a leading team of experts and advanced failure analysis equipment, which can provide non-destructive analysis, electrical characteristic/electrical positioning analysis, destructiveread more
-
X-Ray NDT TestingX-Ray NDT Testing is a mature non-destructive testing method widely used in material inspection (IQC), failure analysis (FA), quality control (QC), quality assurance and reliability (QA/REL),read more
-
Surface Insulation Resistance (SIR) TestThe Surface Insulation Resistance (SIR) test can be used to evaluate problems caused by short circuits or current leaks between metal conductors, helping to identify whether any flux or otherread more
-
Milling Grinding TestsThe commonly used inspection and analysis methods for electronic component failure analysis can be classified into non-destructive analysis and destructive analysis. Destructive analysis is theread more
-
Digital (3C) Product TestingGRGTEST can provide quality control for product development, design, production, and sales processes, helping companies identify product quality issues and tailor effective solutions.read more
We are professional failure analysis service provider in China, providing the best labs and solutions. Please feel free to contact us for quotation.
failure analysis, aec q200 product test of resistance capacitance inductances and other components, ion cleanliness testingSend Inquiry
