Service Content
- Detect defects such as cracks and foreign objects inside metal materials and components, electronic components, LED components, etc., as well as analyze internal displacement of BGA, circuit boards, etc
- Identify BGA welding defects such as empty solder joints and virtual solder joints, and analyze the internal conditions of cables, fixtures, plastic parts, etc
Service Scope
Mainly used for SMT LED.BGA.CSP flip chip inspection, semiconductor, packaging components, lithium battery industry, electronic components, automotive parts, photovoltaic industry, aluminum die-casting mold casting, molded plastics, ceramic products and other special industries.
Test items
GB/T19293-2003,GB17925-2011,GB/T 23909.1-2009,etc.
For more testing standards, please contact our online customer service.
Qualifications
Certified by CNAS CMA and over 60 OEMs and Tier1.
Test Cycle
About 3-5 days
Our Srengths
GRGT focuses on integrated circuit failure analysis technology and has a leading expert team and advanced failure analysis equipment in the industry. It can provide customers with complete failure analysis and testing services, helping manufacturers quickly and accurately locate failures and find the root cause of failures. At the same time, we can provide failure analysis consulting for different applications, assist customers in experimental planning, and provide analysis and testing services based on their R&D needs. For example, we can cooperate with customers to carry out NPI stage validation and assist customers in completing batch failure analysis during the mass production stage (MP).
Test Case
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