Failure Analysis of Semiconductor Chips

Failure Analysis of Semiconductor Chips
Details:
GRGT has a leading team of experts and advanced failure analysis equipment, which can provide non-destructive analysis, electrical characteristic/electrical positioning analysis, destructive analysis, microscopic analysis and Failure analysis of semiconductor chips.
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Description
Technical Parameters
Test items

 

(1) Non destructive analysis: X-ray, SAT, OM visual inspection.

(2) Electrical characteristics/electrical positioning analysis: IV curve measurement, Photon Emission, OBIRCH, ATE testing, and three temperature (room temperature/low temperature/high temperature) verification.

(3) Destructive analysis: plastic opening, delamination, board level slicing, chip level slicing, push-pull force testing.

(4) Microscopic analysis: DB FIB section analysis, FESEM examination, EDS micro area elemental analysis.

 

Test Standards

 

MIL-STD-883H,GJB128B-2021,MIL-STD-750D,MIL-STD-883G,QJ10003-2008,GB/T19293-2003,JESD22-A103/ A104/ A105/ A108/ A110,J-STD-020,JS-001/002,JESD78

 

For more testing standards, please contact our online customer service.

 

Qualifications

 

Certified by CNAS and over 60 OEMs and Tier1.

Classification Society Approval

product-813-538

 

Test Cycle

 

About 3-5 days

 

Our Srengths

 

  • GRGT has an industry-leading team of experts and advanced failure analysis equipment, which can provide customers with complete failure analysis and testing services
  • Assist manufacturers in quickly and accurately locating failures and identifying their root causes
  • Provide failure analysis consulting for different applications, assist clients in experimental planning, and provide analysis and testing services based on their research and development needs. If cooperating with customers to carry out NPI stage verification, assist customers in completing batch failure analysis during the mass production stage (MP).

 

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