Service Background
AEC-Q 104 certification testing is a stress testing certification specification for automotive multi chip components (MCM) based on failure mechanisms. The MCM multi chip module specification solves the problem of whether IC design manufacturers and Tier 1 automotive module vendors should follow IC or module specifications in complex multi chip forms such as MCM, System In Package (SIP), and Stacked Chip. It is also the first time in the automotive industry standards that the Board Level Reliability (BLR) testing project for automotive use has been defined.
Product Range
Automotive multi chip components
Test Items
●Group A: Accelerated environmental stress testing (6 items)
● Group B: Accelerated Life Simulation Test (3 items)
●Group C: Packaging and assembly integrity testing (8 items)
● Group D: Reliability testing of wafer manufacturing (5 items)
● Group E: Electrical characteristic confirmation test (10 items)
● Group F: Defect screening monitoring test (2 items)
● Group G: Integrity testing of air sealed devices (8 items)
● Group H: Module specific testing (7 items)
Test Cycle
About 2-3 months
Test Process
Example of Case
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