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IC, as an important automotive component, is a key area of continuous attention for the AEC committee. The reliability testing of AEC-Q100 on ICs can be subdivided into accelerated environmental stress reliability, accelerated life simulation reliability, packaging reliability, wafer process reliability, electrical parameter verification, defect screening, packaging integrity testing, and the testing conditions need to be selected based on the temperature level that the device can withstand.
The verification of AEC-Q100 certification testing requires the cooperation of wafer suppliers and packaging and testing factories, which further tests the overall control ability of certification testing. RGT will evaluate customers' ICs based on their requirements and standards, and provide a reasonable certification plan to assist in the reliability certification of ICs.
Test Cycle
About 3-4 months.
Test Items
|
S/N |
Test Item |
Abbreviation |
Sample Number/Batch |
Batch Number |
Test Method |
|
Group A Accelerated Environmental Stress Test |
|||||
|
A1 |
Preconditioning |
PC |
77 |
3 |
J-STD-020, |
|
JESD22-A113 |
|||||
|
A2 |
Temperature-Humidity-Bias |
THB |
77 |
3 |
JESD22-A101 |
|
Biased HAST |
HAST |
JESD22-A110 |
|||
|
A3 |
Autoclave |
AC |
77 |
3 |
JESD22-A102 |
|
Unbiased HAST |
UHST |
JESD22-A118 |
|||
|
Temperature-Humidity (without Bias) |
TH |
JESD22-A101 |
|||
|
A4 |
Temperature Cycling |
TC |
77 |
3 |
JESD22-A104,Appendix 3 |
|
A5 |
Power Temperature Cycling |
PTC |
45 |
1 |
JESD22-A105 |
|
A6 |
High Temperature Storage Life |
HSTL |
45 |
1 |
JESD22-A103 |
|
Group B Accelerated life simulation test |
|||||
|
B1 |
High Temperature Operating Life |
HTOL |
77 |
3 |
JESD22-A108 |
|
B2 |
Early Life Failure Rate |
ELFR |
800 |
3 |
AEC-Q100-008 |
|
B3 |
NVM Endurance, Data Retention, and Operational Life |
EDR |
77 |
3 |
AEC-Q100-005 |
|
Group C Encapsulation integrity testing |
|||||
|
C1 |
Wire Bond Shear |
WBS |
30 bonding wires in at least 5 devices |
AEC-Q100-001,AEC-Q003 |
|
|
C2 |
Wire Bond Pull |
WBP |
MIL-STD883 method 2011, |
||
|
AEC-Q003 |
|||||
|
C3 |
Solderability |
SD |
15 |
1 |
JESD22-B102或 J-STD-002D |
|
C4 |
Physical Dimensions |
PD |
10 |
3 |
JESD22-B100, JESD22-B108 |
|
AEC-Q003 |
|||||
|
C5 |
Solder Ball Shear |
SBS |
At least 5 bonding balls for 10 devices |
3 |
AEC-Q100-010, |
|
AEC-Q003 |
|||||
|
C6 |
Lead Integrity |
LI |
At least 10 leads for 5 devices |
1 |
JESD22-B105 |
|
Group D Wafer manufacturing reliability testing |
|||||
|
D1 |
Electromigration |
EM |
/ |
/ |
/ |
|
D2 |
Time Dependent Dielectric Breakdown |
TDDB |
/ |
/ |
/ |
|
D3 |
Hot Carrier Injection |
HCI |
/ |
/ |
/ |
|
D4 |
Negative Bias Temperature Instability |
NBTI |
/ |
/ |
/ |
|
D5 |
Stress Migration |
SM |
/ |
/ |
/ |
|
Group E Electrical verification testing |
|||||
|
E1 |
Pre- and Post-Stress Function/Parameter |
TEST |
All samples required for stress testing in electrical testing |
Supplier or user specifications |
|
|
E2 |
Electrostatic Discharge Human Body Model |
HBM |
Reference Test Specification |
1 |
AEC-Q100-002 |
|
E3 |
Electrostatic Discharge Charged Device Model |
CDM |
Reference Test Specification |
1 |
AEC-Q100-011 |
|
E4 |
Latch-Up |
LU |
6 |
1 |
AEC-Q100-004 |
|
E5 |
Electrical Distributions |
ED |
30 |
3 |
AEC Q100-009 |
|
AEC Q003 |
|||||
|
E6 |
Fault Grading |
FG |
- |
- |
AEC-Q100-007 |
|
E7 |
Characterization |
CHAR |
- |
- |
AEC-Q003 |
|
E9 |
Electromagnetic Compatibility |
EMC |
1 |
1 |
SAE J1752/3- |
|
E10 |
Short Circuit Characterization |
SC |
10 |
3 |
AEC-Q100-012 |
|
E11 |
Soft Error Rate |
SER |
3 |
1 |
JEDEC |
|
JESD89-1 |
|||||
|
JESD89-2 or JESD89-3 |
|||||
|
E12 |
Lead (Pb) Free |
LF |
Reference Test Specification |
Reference Test Specification |
AEC-Q005 |
|
Group F Defect screening test |
|||||
|
F1 |
Process Average Testing |
PAT |
/ |
/ |
AEC-Q001 |
|
F2 |
Statistical Bin/Yield Analysis |
SBA |
/ |
/ |
AEC-Q002 |
|
Group G Sealing and packaging integrity testing |
|||||
|
G1 |
Mechanical Shock |
MS |
15 |
1 |
JESD22-B104 |
|
G2 |
Variable Frequency Vibration |
VFV |
15 |
1 |
JESD22-B103 |
|
G3 |
Constant Acceleration |
CA |
15 |
1 |
MIL-STD883 Method 2001 |
|
G4 |
Gross/Fine Leak |
GFL |
15 |
1 |
MIL-STD883 Method 1014 |
|
G5 |
Package Drop |
DROP |
5 |
1 |
/ |
|
G6 |
Lid Torque |
LT |
5 |
1 |
MIL-STD883 Method 2024 |
|
G7 |
Die Shear |
DS |
5 |
1 |
MIL-STD883 Method 2019 |
|
G8 |
Internal Water Vapor |
IWV |
5 |
1 |
MIL-STD883 Method 1018 |
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