Microstructural Analysis Of Materials

Transmission electron microscopy (TEM) has become an indispensable analytical instrument in the fields of materials and semiconductors. It is an electron optical instrument that uses a high-energy

Advanced process wafer-level FIB sample preparation and TEM analysis services provide precise sample preparation and structural analysis solutions for advanced process chips by performing FIB sample

GRGTEST Metrology provides professional dual-beam focused ion beam (DB-FIB) analysis services. Popular testing services include TEM sample sections for advanced processes (14 nm and below), FA

Wafer cleaving equipment and SEM imaging services are key technological supports for materials science, electronics industry and biomedical research, and are especially suitable for internal

The Bruker Dimension ICON6 atomic force microscope supports 12 modes, including contact, tapping, and peak force tapping, to meet the testing needs of different samples and provide diverse testing

EDS stands for Energy Dispersive Spectrometer, which is an X-ray energy dispersive spectroscopy analysis method. Its principle is based on the fact that different elements emit characteristic X-rays

Compared to traditional gallium-ion focused ion beam (Ga-FIB), PFIB utilizes a more powerful xenon (Xe) ion beam, achieving a maximum current of 2.5 μA at 30 keV energy, which increases its etching