Service Content and Scope Wafer cleaving equipment is a key technology in SEM sample preparation, suitable for high-resolution analysis in materials, electronics, biology, and other fields. Depending on the sample characteristics, mechanical cleaving, FIB cutting, or cryo-cleaving can be selected, and combined with SEM imaging optimization, research efficiency can be significantly improved.
Common Methods and Samples for Spot Cleaving
Mechanical Cleaving: Brittle materials (e.g., silicon wafers, ceramics, certain crystals)
Focused Ion Beam (FIB) Assisted Cleaving: Soft materials, multilayer structures, nanomaterials
Cryo-cleaving: Biological samples, polymers, soft materials
Service Process
Sample Evaluation: Determine sample properties (conductivity, hardness, whether cryo-treatment is required).
Cleavage Method Selection:
- Mechanical Cleaving (brittle materials)
FIB-SEM Dual-Beam Spot Cleaving (precise positioning, such as semiconductor chips)
- Cryo-cleaving (biological/soft materials)
SEM Imaging Optimization: Adjust voltage and detector mode to acquire high-resolution images.
Data Analysis: Provide morphology, composition (EDS), or 3D reconstruction reports (if required).
Service Background
With the development of nanotechnology and intelligent manufacturing, the market demand for this service will continue to grow. Many enterprises and research institutions face numerous challenges in R&D or quality control, such as the need to observe the internal structure of materials (e.g., multilayer films, interface bonding states), the potential damage to critical areas caused by traditional sample preparation methods (e.g., slicing, grinding) leading to inaccurate positioning, the difficulty of manually cleaving samples of tiny sizes (e.g., chips, nanomaterials), and the need for cryogenic cleaving technology due to the susceptibility of biological or soft materials to deformation during conventional sample preparation.
Service Advantages
GRGTEST provides an efficient solution combining "wafer cleaving equipment + SEM imaging services," helping clients locate specific areas for cleavage (e.g., chip solder joints, battery electrode interfaces), reducing sample damage and improving data reliability. Combined with EDS for component analysis (e.g., foreign matter, contaminant detection), it supports R&D, quality control, and failure analysis.
High-Precision Positioning: Precisely locates the cleavage area using an optical microscope or FIB-SEM system.
Multi-Mode Adaptability: Supports conventional SEM, field emission SEM (FE-SEM), cryogenic SEM, etc.
Rapid Response: Provides customized solutions to meet enterprise needs, shortening the R&D cycle.
Data support: Provides high-resolution images and energy dispersive spectroscopy analysis to assist in paper publication or quality reports.
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