Service Content/Scope and Testing Items
a. TEM Thin-Section Samples
An important application of dual-beam focused ion beam microscopy (DB-FIB) is the preparation of ultrathin samples for transmission electron microscopy (TEM). GRGTEST Metrology can provide the following testing items for this application:
Service Content
|
Test Item |
Quotation Unit |
Sample Type |
|
Silicon (Si) Based Sample XS (Cross-section) Sample Preparation |
Each (ea) |
Advanced process chips at 14nm and below; chips at 28nm, 40nm, 55nm and above |
|
Silicon (Si) Based Sample PV (Plan-view) Sample Preparation |
Each (ea) |
Advanced process chips at 14nm and below; chips at 28nm, 40nm, 55nm and above |
|
Non-silicon Based Sample XS (Cross-section) Sample Preparation |
Hour (h) |
Non-silicon based samples, including Gallium Arsenide (GaAs), Gallium Nitride (GaN), Silicon Carbide (SiC), etc. |
|
Non-silicon Based Sample PV (Plan-view) Sample Preparation |
Hour (h) |
Non-silicon based samples, including Gallium Arsenide (GaAs), Gallium Nitride (GaN), Silicon Carbide (SiC), etc. |
|
Special Sample Preparation |
Hour (h) |
Various new material samples, including lithium battery materials, graphene electrode materials, etc. |
b. FA Hotspot Cross-section Analysis
|
Test Item |
Quotation Unit |
Sample Type |
|
FA Hotspot Cross-section Analysis (including hotspots captured by methods like OBIRCH; one-stop testing including hotspot capture is available) |
Hour (h) |
Semiconductor samples: Wafer, IC, components, MEMS, lasers, etc. |
c. Conventional Cross-section Processing
|
Test Item |
Quotation Unit |
Sample Type |
|
Targeted Cross-section Processing |
Hour (h) |
Semiconductor samples: Wafer, IC, components, PCB, MEMS, lasers, etc.;Other non-semiconductor samples |
|
Non-targeted Cross-section Processing |
Hour (h) |
Semiconductor samples: Wafer, IC, components, PCB, MEMS, lasers, etc.;Other non-semiconductor samples |
Testing Cycle
The standard testing cycle is 3 calendar days. For special requirements, we can provide quotes with different response times of 48h, 24h, and 12h.
Our Advantages
GRGTEST Measurement's team members possess relevant experience in advanced wafer manufacturing processes. We adhere to a customer-centric approach and are committed to providing accurate, timely, and comprehensive testing services.
GRGTEST Measurement is the largest state-owned third-party testing company listed in China. Our platform has a sound management mechanism and comprehensive full-process testing and analysis capabilities, enabling us to provide clients with timely and authoritative analysis for complete projects.
Sample Requirements
Anhydrous; samples must not contain any liquid components; stable under ion beam irradiation (some organic samples cannot be detected); dimensions generally not exceeding 10cm*10cm*5cm (length*width*height).
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