Services Offered
Electrical Characteristic Analysis: DCUBE-SCM carrier distribution, CAFM current detection, 3D NAND interface charge
Surface Morphology and Defect Detection: Nanoscale surface morphology imaging, defect localization and analysis, process optimization support
Nanoscale Structure Inspection: Nanowire and nanotube inspection, nanopatterning inspection, nanodevice performance evaluation
Packaging Structure Inspection: Semiconductor material characteristic analysis, new material research, material interface characteristic analysis
Packaging Material Characteristic Analysis: Chip package surface inspection, package internal structure inspection, package defect detection and analysis
Target Clients
Semiconductor wafer fabs, FABs, and packaging plants
Testing Standards
ASTM E2530: AFM Morphology Measurement Method
SEMI MF1812: AFM Test Guide for Semiconductor Surface Roughness
Service Background
The atomic force microscope (AFM) market is experiencing significant growth due to the increasing demand for nanotechnology and high-resolution imaging solutions. The global market value is estimated at US$1.75 billion in 2025 and is projected to grow to US$3.02 billion by 2033, representing a CAGR of 7.09%. Market demand primarily comes from multiple fields, including life sciences, materials science, and semiconductors. In semiconductor manufacturing, AFM (Autonomous Motion Detection) is crucial for inspecting nanoscale features.
Service Value
R&D Value
New Material Screening and Optimization: Accelerates the screening of new semiconductor materials (high-k dielectric layer interface optimization), provides microstructure data, facilitates R&D breakthroughs, and provides strong support for new product development in semiconductor wafer fabs, FABs, and packaging plants.
Nanoscale Defect Localization: The CAFM module provides rapid imaging in 10 minutes, accurately locating nanoscale electrical defects. This improves R&D efficiency, shortens product launch cycles, and helps companies gain a competitive edge in the market.
Production Value
Online Inspection and Quality Control: ScanAsyst automatically scans and detects wafer surface contamination and mechanical damage, enabling real-time quality monitoring during production, ensuring product consistency, and reducing production costs.
Customized Probe Adaptation: A customized probe library with over 40 probes adaptable to different inspection scenarios provides flexible inspection solutions to meet diverse production needs and improve production efficiency.
Value of Failure Analysis
Nanoscale Defect Diagnosis: High-resolution imaging and multimodal analysis accurately diagnose the causes of failures, providing crucial data for product improvement, reducing failure risks, and ensuring product quality.
Case Study
A semiconductor wafer fab encountered a wafer surface contamination problem during production and sought a solution.
GRGTEST Measurement utilized the Dimension ICON6 for XXnm process inspection. The ScanAsyst mode of this equipment quickly identified the contamination source, significantly improving inspection accuracy and efficiency, allowing for timely adjustments to the production process and resolving the problem.
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