Relying on rich resource allocation capabilities, the company actively develops failure analysis for contributing to society, failure analysis for building relationships, failure analysis for increasing profitability industries as the focus of related diversification. We believe that with our improvements, we will be able to provide more quality and reliable failure analysis for handling various loads to all our customers while significantly increasing our production capacity. In the 21st century full of hopes and opportunities, we and our customers are sincere, honorable, go hand in hand, and develop together! In terms of product quality, we constantly innovate and strive to provide more professional technical services for new and old customers. In order to release more resources and promote the innovation and growth of our company, we cooperate with each other in real time. At present, we are fully capable of providing customers with a variety of customized services and technical support. By establishing a scientific and effective talent mechanism and creating a positive and good environment for the growth of talents, we are committed to providing every employee with a stage to fully display their talents, and by constantly creating personal development opportunities, we allow all kinds of talents to have the opportunity and platform to obtain success and realize their self-worth. High quality, fast speed and excellent service are the goals we always pursue, and we sincerely welcome people from all walks of life to patronize and cooperate with us. 'Innovative, rigorous and pragmatic' is the cultural connotation of our company and the value concept of our company is 'staff oriented, create a better future'.
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AEC-Q Certification Testing for AutomotiveAs an accepted test specification for automotive-level electronic components in the world, AEC-Q has become a symbol of the quality and reliability in automotive components. AEC-Q certificationread more
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Advanced FIB & TEM For Wafers AnalysisAdvanced process wafer-level FIB sample preparation and TEM analysis services provide precise sample preparation and structural analysis solutions for advanced process chips by performing FIB sampleread more
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PFIB (Plasma Focused Ion Beam)Compared to traditional gallium-ion focused ion beam (Ga-FIB), PFIB utilizes a more powerful xenon (Xe) ion beam, achieving a maximum current of 2.5 μA at 30 keV energy, which increases its etchingread more
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Ion Cleanliness TestingIon residues on PCB/PCBA surface would decompose into positive and negative ions in a humid atmosphere or other conditions, which would cause improved conductivity of solvent and has seriousread more
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AEC-Q200 Product Test of Resistance-capacitance Inductanc...AEC-200 test standard specifies in detail the operating temperature range of passive components in each component environment in the car, strictly distinguishes the test items of various components,read more
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AEC-Q102 Product Test of Optoelectronic DevicesAEC, composed of Ford, Chrysler and General Motors, has issued the reliability standard AEC-Q102 for optoelectronic devices, which sets strict test requirements for the reliability of optoelectronicread more
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AEC-Q101 Certification Test for Semiconductor Discrete De...AEC-Q101 has sorted out the vehicle reliability requirements for various semiconductor discrete devices. AEC-Q101 test serves as not only a report that can be used worldwide on the reliability ofread more
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AEC-Q100 Certification TestingThe AEC-Q technical team of GRGT Failure Analysis Laboratory has executed a large number of AEC-Q test cases and accumulated rich experience in certification testing, which can provide you with moreread more
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AEC-Q 104 Certification TestingGRGT provides a complete set of AEC-Q 104 certification testing and certification services. By using various testing and analysis techniques and programs to confirm the failure phenomena of products,read more
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Failure Analysis of Semiconductor ChipsGRGT has a leading team of experts and advanced failure analysis equipment, which can provide non-destructive analysis, electrical characteristic/electrical positioning analysis, destructiveread more
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X-Ray NDT TestingX-Ray NDT Testing is a mature non-destructive testing method widely used in material inspection (IQC), failure analysis (FA), quality control (QC), quality assurance and reliability (QA/REL),read more
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Milling Grinding TestsThe commonly used inspection and analysis methods for electronic component failure analysis can be classified into non-destructive analysis and destructive analysis. Destructive analysis is theread more
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You have great goals in everything you do, and you have your own ideas in everything you do, which we appreciate very much.
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We sincerely accept any criticism of our chemical gas chromatography test, Photoaging Solar radiation test, emc testing for electronic uv stabilizers, failure analysis for fostering innovation culture from our customers, and will continue to improve on this basis. We are professional failure analysis for handling various loads service provider in China, providing the best labs and solutions. Please feel free to contact us for quotation.
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