The competitive advantage of our failure analysis for collaborating across departments, failure analysis for enhancing teamwork, automotive failure analysis lies in their versatility, adaptability and green features. We provide customers with perfect products and high-quality services, and strive to create value for customers, and become the best partner for users of failure analysis during maintenance! Do everything possible to carry out service innovation and tap the service potential is the most central content of our management work, and tilting to customers is our service principle that we must persevere. In a fiercely competitive market, we work with our partners to create a brand and provide high-quality products. Benefit from friends from all walks of life, we will make greater contributions to society with more excellent results. From authoritative research and development to rigorous selection process, as well as with advanced production line of exquisite technology, all reflect our determination to provide customers with first-class products. Adhering to the excellent entrepreneurial spirit of our peers, we take 'innovation, quality, modesty and hard work' as our business philosophy. Guided by our development strategy, our company is moving towards the goal of being a world-class enterprise.
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AEC-Q Certification Testing for AutomotiveAs an accepted test specification for automotive-level electronic components in the world, AEC-Q has become a symbol of the quality and reliability in automotive components. AEC-Q certificationread more
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Moiré Substrate Warpage TestingA high-precision Moiré-based substrate warpage measurement system that analyzes light diffraction on sample surfaces. Delivers micron-level deformation measurement with a stable thermal cyclingread more
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Wafer Cleaving Equipment And SEM ImagingWafer cleaving equipment and SEM imaging services are key technological supports for materials science, electronics industry and biomedical research, and are especially suitable for internalread more
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Chip-Level ESD TestingChip-level ESD (Electrostatic Discharge) testing is a reliability test for Integrated Circuits (ICs) used to evaluate a chip's ability to resist electrostatic discharge interference duringread more
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OBC Durability TestThis service, in accordance with the GB/T 40432-2021 standard, conducts 7 categories and 20+ extreme tests on On-Board Chargers (OBCs), including temperature cycling (-40°C to 85°C), damp heat agingread more
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AEC-Q200 Product Test of Resistance-capacitance Inductanc...AEC-200 test standard specifies in detail the operating temperature range of passive components in each component environment in the car, strictly distinguishes the test items of various components,read more
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AEC-Q102 Product Test of Optoelectronic DevicesAEC, composed of Ford, Chrysler and General Motors, has issued the reliability standard AEC-Q102 for optoelectronic devices, which sets strict test requirements for the reliability of optoelectronicread more
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AEC-Q101 Certification Test for Semiconductor Discrete De...AEC-Q101 has sorted out the vehicle reliability requirements for various semiconductor discrete devices. AEC-Q101 test serves as not only a report that can be used worldwide on the reliability ofread more
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AEC-Q100 Certification TestingThe AEC-Q technical team of GRGT Failure Analysis Laboratory has executed a large number of AEC-Q test cases and accumulated rich experience in certification testing, which can provide you with moreread more
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AEC-Q 104 Certification TestingGRGT provides a complete set of AEC-Q 104 certification testing and certification services. By using various testing and analysis techniques and programs to confirm the failure phenomena of products,read more
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Material Consistency Evaluation and ThermodynamicBecause plastic is a formulation system composed of basic resins and a variety of additives, raw materials and processes are difficult to control, resulting in the actual production and product useread more
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Microstructure Analysis and Evaluation of Semiconductor M...With the continuous development of large-scale integrated circuits, the chip manufacturing process is becoming more and more complex, and the abnormal microstructure and composition of semiconductorread more
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