Description

Technical Parameters

A high-precision Moiré-based substrate warpage measurement system that analyzes light diffraction on sample surfaces. Delivers micron-level deformation measurement with a stable thermal cycling control system. Purpose-built for chip, precision component, and microelectronic packaging reliability assessment. Fully compliant with JEDEC JESD22-B112C, supporting global electronic packaging warpage measurement, especially in high-temperature reflow soldering scenarios.

ISO/IEC 17025 Accredited
CMA Certified
CNAS Certified
Global Report Recognition

Testing Services

Test Function	Applicable Samples	Primary Application	Reference Standards
Static Warpage Measurement	PCB boards, electronic components, wafers, thin films, etc.	Room-temperature flatness inspection	JEDEC JESD22-B112A, IPC-6012
Temperature-Dependent Warpage Measurement		Thermal stress analysis, reflow soldering simulation	JEDEC JESD22-B112A, IPC-6012
Dynamic Warpage Measurement		Real-time monitoring during reflow soldering	JEDEC JESD22-B112A
3D Surface Mapping		Detailed planar analysis, spatial reconstruction	Per customer requirements
Defect Detection		Identification of assembly problem areas	Per customer requirements
Custom Testing		Specific temperature profiles or mechanical preload testing	Per customer requirements

Key Information

Industries Served

Electronics manufacturing, PCB fabrication & semiconductor packaging, materials science & engineering

Testing Standards

JEDEC JESD22-B112A • IPC-6012

Test Items

Static warpage • Temperature-dependent warpage • Dynamic warpage • 3D surface mapping • Defect detection • Custom testing

Turnaround Time

10 working days (standard); expedited testing available upon request

Service Background

The Moiré warpage testing system addresses the electronics industry's demand for high-precision warpage measurement, particularly for quality control under thermal stress conditions. By delivering a non-contact, high-resolution measurement method, it efficiently assists customers in verifying component flatness, optimizing design and manufacturing processes, and improving the reliability and quality of electronic products.

Why Choose Our Testing Services

Comprehensive One-Stop Service

We provide a full-range service spanning component screening, testing, and failure analysis - covering reliability testing, environmental testing, and failure mechanism analysis. This eliminates the hassle of coordinating with multiple vendors.

Extensive Industry Experience

With deep expertise across electronics, automotive, telecommunications, and power industries, we understand component- and PCB-specific failure modes. Our team rapidly pinpoints issues and delivers customized solutions.

Internationally Accredited

CNAS (ISO/IEC 17025) and CMA accredited, with globally recognized test reports. Our certifications help customers meet compliance requirements in both domestic and international markets.

Frequently Asked Questions

What are the resolution and repeatability of Moiré warpage testing?

Gratings are selected based on customer requirements and sample characteristics. For samples smaller than 50 mm, resolution and repeatability reachsub-micron level (<1 µm). For larger samples, resolution and repeatability are within2.54 µm

What sample types are suitable for this test?

Moiré warpage testing is primarily used for smooth, continuous surfaces such asPCBs, BGAs, LGAs, and semiconductor packages. It is also applicable to material testing and biomedical imaging.

What is the temperature range of the testing equipment?

The temperature control system supports testing fromroom temperature up to 280 °Cfor high-temperature measurements.
Please pay attention to safety when using,wait until the power is turned on to warm up before operation