Silicon carbide (SiC), as the core material of the third generation semiconductor, has shown great application potential in new energy vehicles, 5G communication, data centers and other fields by virtue of its high power density, excellent high temperature resistance and efficient power conversion ability.
However, advanced packaged SiC power modules face numerous challenges in failure analysis, especially during chemical demolding, X-ray, and acoustic scanning tests, where domestic technology is still immature. In response to this, the Institute of Integrated Circuit Testing and Analysis at GRGTEST has introduced advanced packaging SiC power module failure analysis technology. This technology successfully addresses the entire process of module failure analysis, filling the technical gap in this field domestically and promoting the widespread application of SiC power modules.
Tackle a variety of technical problems and establish a full process solution
In view of the technical problems in the failure analysis of advanced packaging SiC power modules, the Institute of Integrated Circuit Testing and Analysis has developed a number of innovative solutions for SiC power modules, such as chemical opening technology, single-chip laser opening technology and device thinning technology, which have successfully solved the problems of poor electrode integrity of chips after module opening and difficulties in X-Ray and acoustic scanning tests.
(1) Chemical opening technology: By finding the optimal opening conditions under different temperature and ratio conditions, the integrity of the electrode structure on the chip surface is ensured, which solves the problem that the chip electric is very easy to damage after module opening.
(2)Single-chip laser opening technology: In view of the large module opening area, single-chip laser opening and single-directional corrosion are proposed to accurately control the corrosion process of plastic packaging material and retain the chip surface structure to the greatest extent.
(3)Device thinning technology: By thinning the device, the problem of advanced packaging module in X-Ray and acoustic scanning test is solved, and the accuracy and reliability of the test are improved.
In addition, the team also built a chip failure analysis database to correspond the chip failure phenomenon with the failure logic, successfully overcome the whole process of module failure analysis, and provided strong technical support for the reliability evaluation of SiC power module.
Service advantages
- Expand service scope: fill the technical gap of failure analysis of advanced domestic packaging SiC power modules, and provide comprehensive physical analysis and failure analysis services.
- Improve detection efficiency: Through laser opening precision control and thinning technology, shorten module opening and testing time, improve the efficiency of failure analysis.
- Improve detection accuracy: optimize X-Ray and acoustic scanning test conditions by physical thinning means to improve detection resolution and reliability.
SiC Power module full process solution to help industrial upgrading
In view of the test difficulties in failure analysis of advanced packaging SiC power modules, radio and television measurement has established the failure analysis technology of advanced packaging SiC power modules to ensure the reliability and accuracy of testing, which can be widely used in the reliability and failure analysis of SiC power modules in new energy vehicles, 5G communication, data centers, third-generation semiconductors and other fields.
GRGTEST has built a series of projects, including verification and competitive product analysis of components, testing and process evaluation of integrated circuits, quality improvement project of semiconductor power devices, AEC-Q certification of automotive-grade chips and components, and AQG 324 of automotive-grade power modules.
Failure Analysis / Automotive Failure Analysis
