In high-reliability fields such as automotive electronics and industrial control, mechanical vibration, assembly stress, and thermomechanical fatigue often lead to chip fracture failures. Products lacking systematic strength validation exhibit significantly higher early failure rates, seriously compromising reliability and product life cycle. GRGTEST offers professional chip strength and fatigue testing services to accurately resolve mechanical failure issues.

Precise Strength Quantification

• Three-Point Bending Test (ASTM D790)
• Weibull Fracture Critical Load Analysis (Confidence Interval ≥ 95%)

Fatigue Life Modeling

• High-Frequency Cyclic Testing (10⁶–10⁹ cycles, ±1% load control accuracy @10N)
• Stress-Life (S-N) Curve Construction

Root Cause Analysis

• DIC Digital Speckle Tracking for micro-crack initiation (1μm resolution)
• SEM/EDS Fracture Interface Composition Analysis

Case 1: Automotive Chip Bending Fracture

• Issue: Fracture during SMT assembly
• Solution: Custom 3-point bending fixture; max strain threshold ≤ 0.8%
• Outcome: Optimized dicing process; passed automotive-grade certification

Case 2: Optocommunication Chip Passivation Layer Fatigue

• Issue: 23% failure rate after 10⁵ bending cycles
• Solution: S-N model; critical stress amplitude Δσ < 120MPa
• Outcome: Adjusted SiNₓ deposition parameters; fatigue life increased by 4x

GRGTEST is a leading third-party testing institution in IC and SiC fields, with extensive technical capabilities and industry recognition. We have validated over 100 chip types including MCUs, AI chips, and security chips, supporting multiple products from engineering to mass production.

For mechanical reliability testing of chips used in automotive, industrial control, optocommunication, and other applications, contact us for customized solutions.