GRGTEST FIB technology enables accurate quality control
In fields such as material science, electronic manufacturing, and surface engineering, film thickness measurement is a critical step in ensuring product quality and performance. The accuracy of the film layer's thickness directly impacts the product's reliability, functionality, and lifespan. However, traditional film thickness testing methods often face numerous limitations when dealing with complex and diverse samples and high-precision testing requirements.
The dilemma of traditional film thickness testing methods
1. Sample preparation mirror detection thickness: sample preparation is complicated and the accuracy is limited
To measure the thickness of a sample, it must first be sealed with epoxy resin, then ground and polished with sandpaper, and finally measured using a microscope. This process demands a high level of sample preparation, ensuring that there is no delamination between the film surface and the sealing material. The epoxy resin sealing process releases a significant amount of heat, which can adversely affect the thermal-sensitive film layer.
2. XRF fluorescence thickness measurement: narrow application range, insufficient accuracy
XRF fluorescence thickness measurement must have standard pieces corresponding to the metal and thickness range, and cannot measure the thickness of non-metallic films. At the same time, as a non-destructive test method, the accuracy error is large in the level below 100 nanometers, which is difficult to meet the requirements of high precision detection.
FIB technology: break through the limitations of traditional, open a new chapter of precision detection
GRGTEST employs FIB (focused ion beam) technology, which, with its unique working principle and significant advantages, offers a revolutionary solution for film thickness testing. This technology uses electromagnetic lenses to focus the ion beam into an extremely small size, resulting in a highly precise and energetic beam. By bombarding the sample surface with a high-energy ion beam, the sputtering effect is produced, effectively removing material through etching.
- For sensitive organic films and other samples, FIB technology can deposit a protective layer, greatly reduce the impact of etching process on the sample, completely avoid the thermal stress problem generated during epoxy solidification, and ensure that the performance of the thermally sensitive film layer is not damaged.
- The problem of film extension is fundamentally avoided by using ion beam etching.
- In addition to the known protective layer elements, FIB technology does not introduce other elements during the test process, and can completely avoid the interference of external pollution elements in the sample preparation process to the analysis of the surface or internal components of the film layer.
