Service Content
GRGTEST simulates junction temperature fluctuations during device operation by applying load current heating and switching actions. Through accelerated aging, it identifies inherent weaknesses in the device packaging and evaluates the impact of variations in thermal expansion coefficients of packaging materials on device lifespan. This test represents the most critical reliability assessment for power device packaging and serves as the foundation for establishing device life models and conducting longevity evaluations.
Service Scope
Automotive-grade power device modules and equivalent special design products based on discrete components.
Test Standards
- DINENISO/IEC17025:General Requirements for the Competenceof Testing and Calibration Laboratories
- IEC 60747 series:Semiconductor Devices, Discrete Devices
- IEC 60749 series:Semiconductor Devices ‒ Mechanical and Climatic Test Methods
- DIN EN 60664 series:Insulation Coordination for Equipment Within Low-Voltage Systems
- DIN EN 60069 series:Environmental testing
- JESD22-A119:2009:Low Temperature Storage Life
Test Items
Power cycle testing is categorized into second-level power cycles (PCsec) and minute-level power cycles (PCmin), depending on the heating duration under different load currents. As specified in the testing standard for the power electronics module AQG324, the evaluated package components vary accordingly.
As shown in the table below:

Qualifications
CNAS

Test Cycle
Regularly 5–7 working days
Service Background
Power cycle testing is recognized as the most critical experiment for evaluating the reliability of power device packaging, particularly given the rapid advancement of SiC MOSFET power devices, which has become a major research focus in recent years. Unlike other reliability tests, although the principle of power cycle testing is straightforward, its testing techniques, methodologies, and data processing involve interdisciplinary approaches spanning semiconductor physics, electromagnetism, heat transfer, structural mechanics, and signal analysis; improper handling may lead to erroneous conclusions.
Our Strengths
- GRGTEST possesses extensive practical expertise in testing Si-based power semiconductor modules, SiC modules, and related components. It stands as one of China's most comprehensive and renowned third-party testing institutions in the SiC field, offering integrated testing services-including specification parameter verification, competitive product analysis, environmental reliability assessment, lifespan durability evaluation, and failure analysis-to numerous semiconductor manufacturers.
- For power cycle testing, GRGTEST has deployed multiple Siemens Power Tester 1800A/1500A units, along with several domestically manufactured high-reliability models. These systems support various cooling configurations-including water-cooling, water-ethylene glycol hybrid cooling, and oil-cooling-and meet the requirement for operating temperatures ranging from 20°C to 125°C, with ample production capacity available.
- Our technical expertise assists manufacturers in conducting AQG324 certification testing; supported by experienced experts in material science and electrical performance reliability, we provide comprehensive failure analysis and design/implementation of reliability validation solutions for power semiconductors.
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